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1. general description the TFA9890 is a high efficiency class-d aud io amplifier with a s ophisticated speaker boost and protection algorithm. it can deliver 7.2 w peak output power into an 8 ? speaker at a supply voltage of 3.6 v. the internal boost converter raises the supply voltage to 9.5 v, providing ample headroom for major improvements in sound quality. a safe working environment is provided for the speaker under all operating conditions. the TFA9890 maximizes acoustic output while ensuring diaphragm displacement and voice coil temperature do not exceed their ra ted limits. this function is based on a speaker box model that operates in all loudspeaker environments (e.g. free air, closed box or vented box). furthermore, advanced signa l processing ensures the quality of the audio signal is never degraded by unwanted clipping or distortion in the amplifier or speaker. unlike competing solutions, the adaptive sound maximizer algorithm uses feedback to accurately calculate both the temperature and the excursion, allowing the TFA9890 to adapt to changes in the acoustic environment. internal intelligent dc- to-dc conversion boosts the supp ly rail to provide additional headroom and power output. the supply voltage is only raised when necessary. this maximizes the output power of the class-d au dio amplifier while lim iting quiescent power consumption. the TFA9890 also incorporates advanced battery protection. by limiting the supply current when the battery voltage is low, it prevents the audio system from drawing excessive load currents from the battery, which could cause a system undervoltage. the advanced processor minimizes the impact of a falling battery voltage on the audio quality by preventing distortion as the battery discharges. the device features low rf susceptibility because it has a digi tal input interface that is insensitive to clock jitter. the second order closed loop architecture used in a class-d audio amplifier provides excellent audio performance and high supply voltage ripple rejection. the audio input interface is i 2 s and the control settings are communicated via an i 2 c-bus interface. the device also provides the speaker with robust protection against esd damage. in a typical application, no additional component s are needed to withstand a 15 kv discharge on the speaker. the TFA9890 is available in a 49-bump wlcsp (wafer level chip-size package) with a 400 ? m pitch. TFA9890 9.5 v boosted audio system wi th adaptive sound maximizer and speaker protection rev. 01 ? 17 may 2013 preliminary short data sheet
TFA9890_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. preliminary short data sheet rev. 01 ? 17 may 2013 2 of 31 nxp semiconductors TFA9890 9.5 v boosted audio system with adaptive sound maximizer and speaker protection 2. features and benefits ? sophisticated speaker-boost and protec tion algorithm that maximizes speaker performance while protecting the speaker: ? fully embedded software, no additional license fee or porting required ? total integrated solution that includes dsp, amplifier, dc-to-dc, sensing and more ? adaptive excursion control - guarantees t hat the speaker membrane excursion never exceeds its rated limit ? real-time temperature protection - direct measurement ensures that voice coil temperature never exceeds its rated limit ? environmentally aware - automatically adap ts speaker parameters to acoustic and thermal changes including compensation for speaker-box leakage ? output power: 3.6 w (rms) into 8 : at 3.6 v supply voltage (thd = 1 %) ? clip avoidance - dsp algorithm prevents clip ping even with sagging supply voltage ? bandwidth extension option to increase low frequency response ? compatible with standard ac oustic echo cancellers (aecs) ? high efficiency and low power dissipation ? wide supply voltage range (fully operational from 3 v to 5.5 v) ? two i 2 s inputs to support two audio sources ? i 2 c-bus control interface (400 khz) ? dedicated speech mode with speech activity detector ? speaker current and voltage monitoring (via the i 2 s-bus) for acoustic echo cancellation (aec) at the host ? fully short-circuit proof across the load and to the supply lines ? sample frequencies from 8 khz to 48 khz supported ? 3 bit clock/word select ratios supported (32x, 48x, 64x) ? option to route i 2 s input direct to i 2 s output to allow a second i 2 s output slave device to be used in combi nation with the TFA9890 ? tdm interface supported (with limited functionality) ? volume control ? low rf susceptibility ? input clock jitter in sensitive interface ? thermally protected ? 15 kv system-level esd protecti on without external components ? ?pop noise' free at all mode transitions 3. applications ? mobile phones ? ta b l e ts ? portable navigation devices (pnd) ? notebooks/netbooks ? mp3 players and portable media players ? small audio systems
TFA9890_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. preliminary short data sheet rev. 01 ? 17 may 2013 3 of 31 nxp semiconductors TFA9890 9.5 v boosted audio system with adaptive sound maximizer and speaker protection 4. quick reference data 5. ordering information table 1. quick reference data symbol parameter conditions min typ max unit v bat battery supply voltage on pin v bat 3-5.5v v ddd digital supply voltage on pin v ddd 1.65 1.8 1.95 v i bat battery supply current on pin v bat and in dc-to-dc converter coil; operating modes with load; dc-to-dc converter in adaptive boost mode (no output signal, v bat = 3.6 v, v ddd = 1.8 v) -4-ma power-down mode - 1 - ? a i ddd digital supply current on pin v ddd ; operating modes; speakerboost protection activated -20-ma on pin v ddd ; operating modes; coolflux dsp bypassed -6-ma on pin v ddd ; power-down mode; bck1= ws1=datai1 =bck2= ws2= datai2 = datai3 = 0 v -10- ? a p o(rms) rms output power thd+n = 1 %; clip = 0 r l =8 ? ; f s = 48 khz - 3.6 - w r l =8 ? ; f s = 32 khz - 3.7 - w table 2. ordering information type number package name description version TFA9890uk wlcsp49 wafer level chip-size package; 49 bumps TFA9890uk
TFA9890_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. preliminary short data sheet rev. 01 ? 17 may 2013 4 of 31 nxp semiconductors TFA9890 9.5 v boosted audio system with adaptive sound maximizer and speaker protection 6. block diagram fig 1. block diagram i 2 c interface g1 g3 v ddd TFA9890 f1 sda scl ads1 f2 010aaa816 ads2 f3 protection: otp ovp uvp ocp idp v bat g2 outa outb class-d audio amplifier c6 a6 ws1 pwm speaker protection algorithm and volume contol (coolflux dsp) datai3 b3 a1 a2 datai1 bck1 b1 i 2 s input interface (x2) ram/rom memory datao a3 i 2 s output interface gndp b5, b6 temp sense v bat sense v ddp a7, b7, c7 registers a4 int e3 test2 d3 test3 c3 test4 adc current- sensing processor current sensing m u x ws2 d1 c1 datai2 bck2 e1 m u x i2sdoc pll isel rst b4 test5 c4 d4 test6 test7 e4 gndd a5, b2, c2, c5, d2, d5, e2, f4, g4 inb adaptive dc-to-dc converter e7, f7, g7 bst gndb e5, f5, g5 e6, f6, g6
TFA9890_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. preliminary short data sheet rev. 01 ? 17 may 2013 5 of 31 nxp semiconductors TFA9890 9.5 v boosted audio system with adaptive sound maximizer and speaker protection 7. pinning information 7.1 pinning a. bottom view b. transparent top view fig 2. bump configuration 123 g f 4 567 c b a 010aaa782 bump a1 index area e d a b 123 bump a1 index area 456 7 c d e 010aaa783 f g transparent top view fig 3. bump mapping datai1 datao int gndd 234 5 gndd rst gndd test5 gndd outb 67 gndp outa n.c. n.c. gndd test7 gndb test2 inb test6 ws1 1 a b datai2 c ws2 d bck2 e bck1 ads1 inb gndd gndb v ddd 010aaa807 inb gndd sdaf sclg datai3 gndp gndd gndd gndb test4 test3 ads2 v ddp v ddp v ddp v bat bst bst bst
TFA9890_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. preliminary short data sheet rev. 01 ? 17 may 2013 6 of 31 nxp semiconductors TFA9890 9.5 v boosted audio system with adaptive sound maximizer and speaker protection table 3. pinning symbol pin type description ws1 a1 i digital audio word select input 1 datai1 a2 i digital audio data input 1 datao a3 o digital audio data output int a4 o interrupt output gndd a5 p digital ground outb a6 o inverting output v ddp a7 p power supply voltage bck1 b1 i digital audio bit clock input 1 gndd b2 p digital ground datai3 b3 i digital audio data input 3 rst b4 i reset input gndp b5 p power ground gndp b6 p power ground v ddp b7 p power supply voltage datai2 c1 i digital audio data input 2 gndd c2 p digital ground test4 c3 o test signal input 4; for test purposes only, connect to pcb ground test5 c4 o test signal input 5; for test purposes only, connect to pcb ground gndd c5 p digital ground outa c6 o non-inverting output v ddp c7 p power supply voltage ws2 d1 i digital audio word select input 2 gndd d2 p digital ground test3 d3 o test signal input 3; for test purposes only, connect to pcb ground test6 d4 o test signal input 6; for test purposes only, connect to pcb ground gndd d5 p digital ground n.c. d6 - not connected [1] n.c. d7 - not connected [1] bck2 e1 i digital audio bit clock input 2 gndd e2 p digital ground test2 e3 o test signal input 2; for test purposes only, connect to pcb ground test7 e4 o test signal input 7; for test purposes only, connect to pcb ground gndb e5 p boosted ground inb e6 p dc-to-dc boost converter input bst e7 o boosted supply voltage output sda f1 i/o i 2 c-bus data input/output ads1 f2 i address select input 1 ads2 f3 i address select input 2 gndd f4 p digital ground gndb f5 p boosted ground inb f6 p dc-to-dc boost converter input
TFA9890_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. preliminary short data sheet rev. 01 ? 17 may 2013 7 of 31 nxp semiconductors TFA9890 9.5 v boosted audio system with adaptive sound maximizer and speaker protection [1] can be used to simplify routing to outa (see figure 3 ). bst f7 o boosted supply voltage output scl g1 i i 2 c-bus clock input v bat g2 p battery supply voltage sense input v ddd g3 p digital supply voltage gndd g4 p digital ground gndb g5 p boosted ground inb g6 p dc-to-dc boost converter input bst g7 o boosted supply voltage output table 3. pinning ?continued symbol pin type description
TFA9890_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. preliminary short data sheet rev. 01 ? 17 may 2013 8 of 31 nxp semiconductors TFA9890 9.5 v boosted audio system with adaptive sound maximizer and speaker protection 8. functional description the TFA9890 is a highly efficient mono bridge tied load (btl) class-d audio amplifier with a sophisticated speakerbo ost protection algorithm. figure 1 is a block diagram of the TFA9890. it contains three i 2 s input interfaces and one i 2 s output interface. one of i 2 s inputs datai1 and datai2 can be selected as the audio input stream. the third i 2 s input, datai3, is provided to support stereo applications. a ?pass-through? option allows one of the i 2 s input interfaces to be connected directly to the i 2 s output. the pass-through option is provided to allow an i 2 s output slave device (e.g. a co dec), connected in parallel with the TFA9890, to be routed directly to the audio host via the i 2 s output. the i 2 s output signal on datao can be configured to transmit the dsp output signal, amplifier output current information, datai3 left or right signal information or amplifier gain information. the gain information can be used to facilitate communication between two devices in stereo applications. a speakerboost protection algorithm, running on a coolflux digital signal processor (dsp) core, maximizes the acoustical out put of the speaker while limiting membrane excursion and voice coil temperature to a safe level. the mechanical protection implemented guarantees that speaker membrane excursion never exceeds its rated limit, to an accuracy of 10 %. thermal protection guarantees that the voice coil temperature never exceeds its rated lim it, to an accuracy of ? 10 ? c. furthermore, advanced signal processing ensures the audio quality remains acceptable at all times. the protection algorithm implements an adapt ive loudspeaker model that is used to predict the extent of membrane excursion. the model is continuously updated to ensure that the protection scheme remains effect ive even when speaker parameter values change or the acoustic enclosure is modified. output sound pressure levels are boosted within given mechanical, thermal and quality limits. an optional bandwidth extension mode extends the low frequency response up to a predefined limit before maximizing the output le vel. this mode is suit able for listening to high quality music in quiet environments. the frequency response of the TFA9890 can be modified via ten fully programmable cascaded second-order biquad filters. the fi rst two biquads are processed with 48-bit double precision; biquads 3 to 8 are processed with 24-bit single precision. at low battery voltage levels, the gain is automatically reduced to limit battery current. the output volume can be controlled by the speakerb oost protection algorithm or by the host application (external). in the latter case, the boost featur es of the speakerboost protection algorithm must be disabled to avoid neutralizing external volume control. the speakerboost protection algorithm ou tput is converted into two pulse width modulated (pwm) signals which are then inje cted into the class-d audio amplifier. the 3-level pwm scheme supports filterless speaker drive. an adaptive dc-to-dc converter boosts the ba ttery supply voltage in line with the output of the speakerboost protection algorith m. it switches to follower mode (v bst = v bat ; no boost) when the audio output voltage is lower than the battery voltage.
TFA9890_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. preliminary short data sheet rev. 01 ? 17 may 2013 9 of 31 nxp semiconductors TFA9890 9.5 v boosted audio system with adaptive sound maximizer and speaker protection 9. internal circuitry table 4. internal circuitry pin symbol equivalent circuit c1, c4, d1, d3, e1, f2, f3 datai2, test5, ws2, test3, bck2, ads1, ads2 a1, a2, a4, b1, b3, e3, g1 ws1, datai1, int, bck1, datai3, test2, scl, c3 test4 f1 sda a3 datao 010aaa788 esd gndd (e4) c1, c4, d1, d3, e1, f2, f3 010aaa789 esd esd v ddp (b6) gndp (b7) a1, a2, a4, b1, b3, e3, g1 esd gndd (e4) 010aaa790 esd esd v ddd (e3) gndd (e4) c3 010aaa791 esd gndd (e4) f1 010aaa792 esd gndp (b7) gndd (e4) v ddd (e3) a3
TFA9890_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. preliminary short data sheet rev. 01 ? 17 may 2013 10 of 31 nxp semiconductors TFA9890 9.5 v boosted audio system with adaptive sound maximizer and speaker protection a6, c6 outb, outa e6, f6, g6 i.c. a5, b2, b5, b6, c2, c5, d2, d5, e2, e5, f4, f5, g4, g5 gndp, gndb, gndd table 4. internal circuitry pin symbol equivalent circuit 010aaa787 gndp (b7) v ddp (b6) a 6, c6 010aaa793 gndb (d7) sense (e6) e6, f6, g6 gndd (a5, b2, c2, d2, d5, e2, f4, g4) gndb (e5, f5, g5) gndp (b5, b6, c5) 010aaa794
TFA9890_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. preliminary short data sheet rev. 01 ? 17 may 2013 11 of 31 nxp semiconductors TFA9890 9.5 v boosted audio system with adaptive sound maximizer and speaker protection 10. i 2 c-bus interface and register settings the TFA9890 supports the 400 khz i 2 c-bus microcontroller interface mode standard. the i 2 c-bus is used to control the TFA9890 and to transmit and receive data. the TFA9890 can only operate in i 2 c slave mode, as a slave receiv er or as a slave transmitter. 10.1 TFA9890 addressing the TFA9890 is accessed via an 8-bit code (see ta b l e 5 ). bits 1 to 7 contain the device address. bit 0 (r/w ) indicates whether a read (1) or a write (0) operation has been requested. four separate addresses are supported for stereo applications. address selection is via pins ads1 and ads2. the levels on pins ads1 and ads2 determine the values of bits 1 and 2, respectively, of the device address, as detailed in ta b l e 5 . the generic address is independent of pins ads1 and ads2. table 5. address selection via pins ads1 and ads2 ads2 pin voltage (v) ads1 pin voltage (v) address function 0 0 01101000 for write mode 01101001 for read mode 0v ddd 01101010 for write mode 01101011 for read mode v ddd 0 01101100 for write mode 01101101 for read mode v ddd v ddd 01101110 for write mode 01101111 for read mode don?t care don?t care 00011100 (generic address) for write mode don?t care don?t care 00011101 (generic address) for read mode
TFA9890_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. preliminary short data sheet rev. 01 ? 17 may 2013 12 of 31 nxp semiconductors TFA9890 9.5 v boosted audio system with adaptive sound maximizer and speaker protection 11. limiting values 12. thermal characteristics table 6. limiting values in accordance with the absolute ma ximum rating system (iec 60134). symbol parameter conditions min max unit v bat battery supply voltage on pin v bat ? 0.3 +5.5 v v bst voltage on pin bst ? 0.3 +12 v v ddp power supply voltage on pin v ddp ? 0.3 +12 v v ddd digital supply voltage on pin v ddd ? 0.3 +1.95 v t j junction temperature - +150 ?c t stg storage temperature ? 55 +150 ?c t amb ambient temperature ? 40 +85 ?c v esd electrostatic discharge voltage according to human body model (hbm) ? 2+2 kv according to charge device model (cdm) ? 500 +500 v table 7. thermal characteristics symbol parameter conditions typ unit r th(j-a) thermal resistance from junction to ambient in free air; natural convection - 4-layer application board 40 k/w
TFA9890_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. preliminary short data sheet rev. 01 ? 17 may 2013 13 of 31 nxp semiconductors TFA9890 9.5 v boosted audio system with adaptive sound maximizer and speaker protection 13. characteristics 13.1 dc characteristics table 8. dc characteristics all parameters are guaranteed for v bat = 3.6 v; v ddd = 1.8 v; v ddp =v bst = 9.5 v, adaptive boost mode; l bst =1 ? h [1] ; r l = 8 ? [1] ; l l = 40 ? h [1] ; f i = 1 khz; f s = 48 khz; t amb = 25 ? c; default settings, unless otherwise specified. symbol parameter conditions min typ max unit v bat battery supply voltage on pin v bat 3-5.5v i bat battery supply current on pin v bat and in dc-to-dc converter coil; operating modes with load; dc-to-dc converter in adaptive boost mode (no output signal, v bat =3.6 v, v ddd = 1.8 v) -4- ma power-down mode - 1 5 ? a v ddp power supply voltage on pin v ddp 3-9.5v v ddd digital supply voltage on pin v ddd 1.65 1.8 1.95 v i ddd digital supply current on pin v ddd ; operating modes; speakerboost protection activated -20- ma on pin v ddd ; operating modes; coolflux dsp bypassed -6- ma on pin v ddd ; power-down mode; bck1 = ws1 = datai1 = bck2 = ws2 = datai2 = datai3 = 0 v -10- ? a pins bck1, ws1, data1, bck2, ws2, da tai2, datai3, ads1, ads2, scl, sda v ih high-level input voltage 0.7v ddd -3.6 v v il low-level input voltage - - 0.3v ddd v c in input capacitance [2] --3pf i li input leakage current 1.8 v on input pin - - 0.1 ? a pins datao, int, push-pull output stages v oh high-level output voltage i oh =4 ma - - v ddd ? 0.4 v v ol low-level output voltage i ol =4 ma - - 400 mv pins sda, open drain outputs, external 10 k ? resistor to v ddd v oh high-level output voltage i oh =4 ma - - v ddd ? 0.4 v v ol low-level output voltage i ol =4 ma - - 400 mv pins outa, outb r dson drain-source on-state resistance v ddp = 5.3 v - 200 - m ? protection t act(th_prot) thermal protection activation temperature 130 - 150 ?c v ovp(vbat) overvoltage protection voltage on pin vbat 5.5 - 6.0 v v uvp(vbat) undervoltage protection voltage on pin vbat 2.3 - 2.5 v
TFA9890_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. preliminary short data sheet rev. 01 ? 17 may 2013 14 of 31 nxp semiconductors TFA9890 9.5 v boosted audio system with adaptive sound maximizer and speaker protection [1] l bst = boost converter inductance; r l = load resistance; l l = load inductance (speaker). [2] this parameter is not tested during production; the value is guaranteed by design and ch ecked during product validation. i o(ocp) overcurrent protection output current 2-- a dc-to-dc converter v bst voltage on pin bst dcvo = 111; boost mode 9.4 9.5 9.6 v table 8. dc characteristics ?continued all parameters are guaranteed for v bat = 3.6 v; v ddd = 1.8 v; v ddp =v bst = 9.5 v, adaptive boost mode; l bst =1 ? h [1] ; r l = 8 ? [1] ; l l = 40 ? h [1] ; f i = 1 khz; f s = 48 khz; t amb = 25 ? c; default settings, unless otherwise specified. symbol parameter conditions min typ max unit
TFA9890_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. preliminary short data sheet rev. 01 ? 17 may 2013 15 of 31 nxp semiconductors TFA9890 9.5 v boosted audio system with adaptive sound maximizer and speaker protection 13.2 ac characteristics table 9. ac characteristics all parameters are guaranteed for v bat = 3.6 v; v ddd = 1.8 v; v ddp =v bst = 9.5 v, adaptive boost mode; l bst =1 ? h [1] ; r l = 8 ? [1] ; l l = 40 ? h [1] ; f i = 1 khz; f s = 48 khz; t amb = 25 ? c; default settings, unless otherwise specified. symbol parameter conditions min typ max unit amplifier output power p o(rms) rms output power thd+n = 1 %; clip = 0 r l =8 ? ; f s = 48 khz - 3.6 - w r l =8 ? ; f s = 32 khz - 3.7 - w thd+n = 10 %; clip = 0 r l =8 ? ; f s = 48 khz - 4.5 - w r l =8 ? ; f s = 32 khz - 4.6 - w amplifier output; pins outa and outb ?v o(offset) ? output offset voltage absolute value - - 3 mv amplifier performance ? po output power efficiency p o(rms) = 2.5 w; including dc-to-dc converter; 100 hz audio signal [2] -72-% thd+n total harmonic distortion-plus-noise p o(rms) = 100 mw; r l =8 ? ; l l =44 ? h [1] -0.030.1% v n(o) output noise voltage a-weighted; datai1 = datai2 = 0 v coolflux dsp bypassed - 50 - ? v coolflux dsp enabled [2] -66- ? v s/n signal-to-noise ratio v o = 4.5 v (peak); a-weighted coolflux dsp bypassed - 100 - db coolflux dsp enabled [2] -97-db psrr power supply rejection ratio v ripple = 200 mv (rms); f ripple =217 hz - 75 - db f sw switching frequency directly coupled to the i 2 s input frequency 256 - 384 khz amplifier power-up, power-down and propagation delays t d(on) turn-on delay time pll locked on bck (ipll = 0) f s = 8 khz to 48 khz - - 2 ms pll locked on ws (ipll = 1) f s = 8 khz - - 27 ms f s =48 khz - - 6 ms t d(off) turn-off delay time - - 10 ? s t d(mute_off) mute off delay time - 1 - ms t d(soft_mute) soft mute delay time - 1 - ms t pd propagation delay coolflux bypassed f s = 8 khz - - 3.2 ms f s = 48 khz - - 600 ? s speakerboost protection mode, t lookahead =2 ms f s = 8 khz - - 14 ms f s =48 khz - - 4 ms
TFA9890_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. preliminary short data sheet rev. 01 ? 17 may 2013 16 of 31 nxp semiconductors TFA9890 9.5 v boosted audio system with adaptive sound maximizer and speaker protection [1] l bst = boost converter inductor; r l = load resistance; l l = load inductance (speaker). [2] this parameter is not tested during production; the value is guaranteed by design and ch ecked during product validation. current-sensing performance s/n signal-to-noise ratio i o = 1.2 a (peak); a-weighted - 75 - db i sense(acc) sense current accuracy i o = 0.5 a (peak) ? 3- +3% b bandwidth [2] -8-khz l l load inductance 20 - - ? h table 9. ac characteristics all parameters are guaranteed for v bat = 3.6 v; v ddd = 1.8 v; v ddp =v bst = 9.5 v, adaptive boost mode; l bst =1 ? h [1] ; r l = 8 ? [1] ; l l = 40 ? h [1] ; f i = 1 khz; f s = 48 khz; t amb = 25 ? c; default settings, unless otherwise specified. symbol parameter conditions min typ max unit
TFA9890_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. preliminary short data sheet rev. 01 ? 17 may 2013 17 of 31 nxp semiconductors TFA9890 9.5 v boosted audio system with adaptive sound maximizer and speaker protection 13.3 i 2 s timing characteristics [1] l bst = boost converter inductance; r l = load resistance; l l = load inductance. [2] the i 2 s bit clock input (bck) is used as a clock input for the dsp, as well as for th e amplifier and the dc-to-dc converter. note tha t both the bck and ws signals must be present for the clock to operate correctly. [3] this parameter is not tested during production; the value is guaranteed by design and ch ecked during product validation. table 10. i 2 s bus interface characteristics; see figure 4 all parameters are guaranteed for v bat = 3.6 v; v ddd = 1.8 v; v ddp =v bst = 9.5 v, adaptive boost mode; l bst =1 ? h [1] ; r l = 8 ? [1] ; l l = 40 ? h [1] ; f i = 1 khz; f s = 48 khz; t amb = 25 ? c; default settings, unless otherwise specified. symbol parameter conditions min typ max unit f s sampling frequency on pin ws [2] 8 - 48 khz f clk clock frequency on pin bck [2] 32f s -64f s hz t su set-up time ws edge to bck high [3] 10 - - ns data edge to bck high 10 - - ns t h hold time bck high to ws edge [3] 10 - - ns bck high to data edge 10 - - ns fig 4. i 2 s timing bck ws data t h t su 010aaa750
TFA9890_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. preliminary short data sheet rev. 01 ? 17 may 2013 18 of 31 nxp semiconductors TFA9890 9.5 v boosted audio system with adaptive sound maximizer and speaker protection 13.4 i 2 c timing characteristics [1] l bst = boost converter inductance; r l = load resistance; l l = load inductance. [2] c b is the total capacitance of one bus line in pf. the maximum capacitive load for each bus line is 400 pf. [3] after this period, the first clock pulse is generated. [4] to be suppressed by the input filter. table 11. i 2 c-bus interface characteristics; see figure 5 all parameters are guaranteed for v bat = 3.6 v; v ddd = 1.8 v; v ddp =v bst = 9.5 v, adaptive boost mode; l bst =1 ? h [1] ; r l = 8 ? [1] ; l l = 40 ? h [1] ; f i = 1 khz; f s = 48 khz; t amb = 25 ? c; default settings, unless otherwise specified. symbol parameter conditions min typ max unit f scl scl clock frequency - - 400 khz t low low period of the scl clock 1.3 - - ? s t high high period of the scl clock 0.6 - - ? s t r rise time sda and scl signals [2] 20 + 0.1 c b -- ns t f fall time sda and scl signals [2] 20 + 0.1 c b -- ns t hd;sta hold time (repeated) start condition [3] 0.6 - - ? s t su;sta set-up time for a repeated start condition 0.6 - - ? s t su;sto set-up time for stop condition 0.6 - - ? s t buf bus free time between a stop and start condition 1.3 - - ? s t su;dat data set-up time 100 - - ns t hd;dat data hold time 0 - - ? s t sp pulse width of spikes that must be suppressed by the input filter [4] 0 - 50 ns c b capacitive load for each bus line - - 400 pf fig 5. i 2 c timing t buf t low t r t f t hd;sta t su;sta t hd;dat t high t su;dat t hd;sta t su;sto t sp p s sr p sda scl 010aaa225
TFA9890_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. preliminary short data sheet rev. 01 ? 17 may 2013 19 of 31 nxp semiconductors TFA9890 9.5 v boosted audio system with adaptive sound maximizer and speaker protection 14. application information 14.1 application diagrams fig 6. typical mono application (simplified) TFA9890 010aaa817 baseband processor outa outb a6 c6 speaker gndd test2 test3 ads2 gndb f3 gndp ads1 f2 b5 b6 e5 f5 g5 test4 e3 a5 b2 c2 c5 d2 d5 e2 f4 g4 c3d3 g3 v ddd 1.8 v c vddd e7, f7, g7 e6, f6, g6 inb i 2 c sda f1 scl g1 datai3 b3 bck2 e1 datai2 c1 ws2 d1 bck1 datao b1 a3 datai1 a2 i 2 s ws1 a1 rst b4 int a4 test7 test6 test5 c4 e4 d4 n.c. d6 n.c. d7 a7 b7 c7 v ddp c vddp 20 f g2 v bat c vbat 100 nf 100 nf bst battery c bst 10 f l bst 1 h
TFA9890_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. preliminary short data sheet rev. 01 ? 17 may 2013 20 of 31 nxp semiconductors TFA9890 9.5 v boosted audio system with adaptive sound maximizer and speaker protection fig 7. typical stereo application (simplified) TFA9890 outa outb a6 c6 speaker gndd test2 test3 ads2 gndb f3 gndp ads1 f2 b5 b6 e5 f5 g5 test4 e3 a5 b2 c2 c5 d2 d5 e2 f4 g4 c3d3 sda f1 scl g1 datai3 b3 e1 c1 d1 bck1 datao b1 a3 datai1 a2 baseband processor i 2 c i 2 s ws1 a1 rst b4 int a4 test7 test6 test5 c4 e4 d4 n.c. d6 n.c. d7 TFA9890 010aaa818 outa outb a6 c6 speaker gndd test2 test3 ads2 gndb f3 gndp f2 b5 b6 e5 f5 g5 test4 e3 a5 b2 c2 c5 d2 d5 e2 f4 g4 c3d3 sda f1 scl g1 b3 e1 c1 d1 bck1 datao b1 a3 datai1 a2 ws1 a1 rst b4 int a4 test7 test6 test5 c4 e4 d4 n.c. d6 n.c. d7 bck2 datai2 ws2 datai3 bck2 datai2 ws2 ads1 1.8 v bst g3 v ddd 1.8 v e7, f7, g7 e6, f6, g6 inb a7 b7 c7 v ddp c vddp 20 f g2 v bat c vbat 100 nf c vddd 100 nf battery c bst 10 f l bst 1 h bst g3 v ddd 1.8 v e7, f7, g7 e6, f6, g6 inb a7 b7 c7 v ddp c vddp 20 f g2 v bat c vbat 100 nf c vddd 100 nf battery c bst 10 f l bst 1 h
TFA9890_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. preliminary short data sheet rev. 01 ? 17 may 2013 21 of 31 nxp semiconductors TFA9890 9.5 v boosted audio system with adaptive sound maximizer and speaker protection fig 8. typical mono application with two audio sources and a second i 2 s slave device TFA9890 outa outb a6 c6 speaker gndd test2 test3 ads2 gndb f3 gndp ads1 f2 b5 b6 e5 f5 g5 test4 e3 a5 b2 c2 c5 d2 d5 e2 f4 g4 c3d3 sda f1 scl g1 b3 e1 c1 d1 b1 a3 a2 a1 rst b4 int a4 test7 test6 test5 c4 e4 d4 n.c. d6 n.c. d7 datai3 datai2 ws2 bck2 datai1 datao ws1 bck1 010aaa819 data output word select 1 data input 1 second i 2 s slave device (codec) word select 2 data input 2 bit clock 2 i 2 c data o/p word sel. audio source 1 (i 2 s master) i 2 s bit clk. data i/p data o/p word sel. audio source 2 (i 2 s master) i 2 s bit clk. data i/p bst g3 v ddd 1.8 v c vddd e7, f7, g7 e6, f6, g6 inb a7 b7 c7 v ddp c vddp 20 f g2 v bat c vbat 100 nf 100 nf battery c bst 10 f l bst 1 h
TFA9890_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. preliminary short data sheet rev. 01 ? 17 may 2013 22 of 31 nxp semiconductors TFA9890 9.5 v boosted audio system with adaptive sound maximizer and speaker protection 14.2 curves measured in referen ce design (demonstration board) all measurements were taken with v bat = 3.6 v; v ddd = 1.8 v; v ddp = v bst = 5.3 v; l bst =1 ? h; r l = 4 ? ; l l = 20 ? h; f i = 1 khz; f s = 48 khz; t amb = 25 ? c; coolflux dsp bypassed; default settings, unless otherwise specified. r l =8 ? , v bat =3.6 v (1) f i = 6 khz. (2) f i = 1 khz. (3) f i = 100 hz. r l =8 ? , v bat = 3.6 v (1) p o = 100 mw (2) p o = 500 mw fig 9. thd plus noise as a function of output power fig 10. thd plus noise as a function of frequency 010aaa825 10 -3 10 -2 10 -1 1 10 10 -2 10 -1 1 10 10 2 p o (w) thd+n thd+n thd+n (%) (%) (%) (1) (1) (1) (2) (2) (2) (3) (3) (3) 010aaa826 10 10 2 10 3 10 4 10 5 10 -2 10 -1 1 f i (hz) thd+n thd+n thd+n (%) (%) (%) (1) (1) (1) (2) (2) (2) a. fast ramp-up b. immediate ramp-up fig 11. dc-to-dc converter ramp-up behavior 010aaa831 -0.01 -0.004 0.002 0.008 0.014 0.02 -8 -0.2 -4 0.64 0 1.48 4 2.32 8 3.16 12 4 t (s) v bst bst v bst (v) (v) (v) i bat bat i bat (a) (a) (a) v bst bst v bst i bat bat i bat 010aaa830 -0.01 -0.004 0.002 0.008 0.014 0.02 -8 -0.5 -4 0.4 0 1.3 4 2.2 8 3.1 12 4 t (s) v bst bst v bst (v) (v) (v) i bat bat i bat (v) (v) (v) v bst bst v bst i bat bat i bat
TFA9890_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. preliminary short data sheet rev. 01 ? 17 may 2013 23 of 31 nxp semiconductors TFA9890 9.5 v boosted audio system with adaptive sound maximizer and speaker protection r l =8 ? , v bat = 3.6 v , p o = 500 mw r l =8 ? , f i = 1 khz (1) thd+n = 10 %, no boost (follower mode) (2) thd+n = 1 %, no boost (follower mode) (3) thd+n = 10 %, boost on (4) thd+n = 1 %, boost on fig 12. normalized gain as a function of frequency fig 13. output power as a function of battery supply voltage 010aaa827 10 10 2 10 3 10 4 10 5 -1.4 -0.7 0 0.7 1.4 f i (hz) g g (db) (db) (db) 010aaa828 2 2.8 3.6 4.4 5.2 6 0 1.4 2.8 4.2 5.6 7 v bat (v) p o p o (w) (w) (w) (4) (4) (4) (3) (3) (3) (1) (1) (1) (2) (2) (2) r l =8 ? , v bat = 3.6 v , v ripple = 200 v(rms) on v bat fig 14. psrr as a function of ripple frequency 010aaa832 10 10 2 10 3 10 4 10 5 -110 -90 -70 -50 -30 -10 f ripple (hz) psrr psrr psrr (db) (db) (db)
TFA9890_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. preliminary short data sheet rev. 01 ? 17 may 2013 24 of 31 nxp semiconductors TFA9890 9.5 v boosted audio system with adaptive sound maximizer and speaker protection 15. package outline fig 15. package outline TFA9890 (wlcsp49)

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TFA9890_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. preliminary short data sheet rev. 01 ? 17 may 2013 25 of 31 nxp semiconductors TFA9890 9.5 v boosted audio system with adaptive sound maximizer and speaker protection 16. soldering of wlcsp packages 16.1 introduction to soldering wlcsp packages this text provides a very brief insight into a complex technology. a more in-depth account of soldering wlcsp (wafer level chip-size packages) can be found in application note an10439 ?wafer level chip scale package? and in application note an10365 ?surface mount reflow soldering description? . wave soldering is not su itable for this package. all nxp wlcsp packages are lead-free. 16.2 board mounting board mounting of a wlcsp requires several steps: 1. solder paste printing on the pcb 2. component placement with a pick and place machine 3. the reflow soldering itself 16.3 reflow soldering key characteristics in reflow soldering are: ? lead-free versus snpb solderi ng; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see figure 16 ) than a pbsn process, thus reducing the process window ? solder paste printing issues, such as sm earing, release, and adjusting the process window for a mix of large and small components on one board ? reflow temperature profile; this profile includ es preheat, reflow (in which the board is heated to the peak temperature), and coo ling down. it is imper ative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic) while being low enough that the packages and/or boards are not damaged. the peak temperature of the package depends on package thickness and volume and is classified in accordance with ta b l e 1 2 . moisture sensitivity precautions, as indicat ed on the packing, must be respected at all times. studies have shown that small packages reach higher temperatures during reflow soldering, see figure 16 . table 12. lead-free process (from j-std-020d) package thickness (mm) package reflow temperature ( ?c) volume (mm 3 ) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245
TFA9890_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. preliminary short data sheet rev. 01 ? 17 may 2013 26 of 31 nxp semiconductors TFA9890 9.5 v boosted audio system with adaptive sound maximizer and speaker protection for further information on temperature profiles, refer to application note an10365 ?surface mount reflow soldering description? . 16.3.1 stand off the stand off between the substrate and the chip is determined by: ? the amount of printed solder on the substrate ? the size of the solder land on the substrate ? the bump height on the chip the higher the stand off, the better the stresses are released due to tec (thermal expansion coefficient) differences between substrate and chip. 16.3.2 quality of solder joint a flip-chip joint is considered to be a good joint when the entire solder land has been wetted by the solder from the bump. the surface of the joint should be smooth and the shape symmetrical. the soldered joints on a chip should be uniform. voids in the bumps after reflow can occur during the reflow process in bumps with high ratio of bump diameter to bump height, i.e. low bumps with large diameter. no failures have been found to be related to these voids. solder joint inspection after reflow can be done with x-ray to monitor defects such as bridging, open circuits and voids. 16.3.3 rework in general, rework is not recommended. by rework we mean the process of removing the chip from the substrate and replacing it with a new chip. if a chip is removed from the substrate, most solder balls of the chip will be damaged. in that case it is recommended not to re-use the chip again. msl: moisture sensitivity level fig 16. temperature profiles for large and small components 001aac844 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = msl limit, damage level peak temperature
TFA9890_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. preliminary short data sheet rev. 01 ? 17 may 2013 27 of 31 nxp semiconductors TFA9890 9.5 v boosted audio system with adaptive sound maximizer and speaker protection device removal can be done when the substrate is heated until it is certain that all solder joints are molten. the chip can then be carefully removed from the substrate without damaging the tracks and solder lands on the substrate. removing the device must be done using plastic tweezers, because me tal tweezers can damage the silicon. the surface of the substrate should be carefully cleaned and all solder and flux residues and/or underfill remove d. when a new chip is placed on the substrate, use the flux process instead of solder on the solder lands. apply flux on the bumps at the chip side as well as on the solder pads on the substrate. place and align the new chip while viewing with a microscope. to reflow the solder, use the solder profile shown in application note an10365 ?surface mount reflow soldering description? . 16.3.4 cleaning cleaning can be done after reflow soldering.
TFA9890_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. preliminary short data sheet rev. 01 ? 17 may 2013 28 of 31 nxp semiconductors TFA9890 9.5 v boosted audio system with adaptive sound maximizer and speaker protection 17. revision history table 13. revision history document id release date data sheet status change notice supersedes TFA9890_sds v.1 20130517 preliminary data sheet - -
TFA9890_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. preliminary short data sheet rev. 01 ? 17 may 2013 29 of 31 nxp semiconductors TFA9890 9.5 v boosted audio system with adaptive sound maximizer and speaker protection 18. legal information 18.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 18.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 18.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such info rmation. nxp semiconductors takes no responsibility for the content in this document if provided by an information source outside of nxp semiconductors. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors and its suppliers accept no liability for inclusion and/or use of nxp semiconducto rs products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification.
TFA9890_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. preliminary short data sheet rev. 01 ? 17 may 2013 30 of 31 nxp semiconductors TFA9890 9.5 v boosted audio system with adaptive sound maximizer and speaker protection export control ? this document as well as the item(s) described herein may be subject to export control regu lations. export might require a prior authorization from competent authorities. quick reference data ? the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not comple te, exhaustive or legally binding. non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. 18.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 19. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors TFA9890 9.5 v boosted audio system with adaptive sound maximizer and speaker protection ? nxp b.v. 2013. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 17 may 2013 document identifier: TFA9890_sds please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 20. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features and benefits . . . . . . . . . . . . . . . . . . . . 2 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4 quick reference data . . . . . . . . . . . . . . . . . . . . . 3 5 ordering information . . . . . . . . . . . . . . . . . . . . . 3 6 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 pinning information . . . . . . . . . . . . . . . . . . . . . . 5 7.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 functional description . . . . . . . . . . . . . . . . . . . 8 9 internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . . 9 10 i 2 c-bus interface and register settings . . . . . 11 10.1 TFA9890 addressing . . . . . . . . . . . . . . . . . . . 11 11 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 12 12 thermal characteristics . . . . . . . . . . . . . . . . . 12 13 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 13 13.1 dc characteristics . . . . . . . . . . . . . . . . . . . . . 13 13.2 ac characteristics. . . . . . . . . . . . . . . . . . . . . . 15 13.3 i 2 s timing characteristics . . . . . . . . . . . . . . . . 17 13.4 i 2 c timing characteristics . . . . . . . . . . . . . . . . 18 14 application information. . . . . . . . . . . . . . . . . . 19 14.1 application diagrams . . . . . . . . . . . . . . . . . . . 19 14.2 curves measured in reference design (demonstration board) . . . . . . . . . . . . . . . . . . 22 15 package outline . . . . . . . . . . . . . . . . . . . . . . . . 24 16 soldering of wlcsp packages. . . . . . . . . . . . 25 16.1 introduction to soldering wlcsp packages . . 25 16.2 board mounting . . . . . . . . . . . . . . . . . . . . . . . 25 16.3 reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 25 16.3.1 stand off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 16.3.2 quality of solder joint . . . . . . . . . . . . . . . . . . . 26 16.3.3 rework . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 16.3.4 cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 17 revision history . . . . . . . . . . . . . . . . . . . . . . . . 28 18 legal information. . . . . . . . . . . . . . . . . . . . . . . 29 18.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 29 18.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 18.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 18.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 30 19 contact information. . . . . . . . . . . . . . . . . . . . . 30 20 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

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